Chiplets Solutions for Custom IC (CHISIC) Design Workshop

The IEEE Custom Integrated Circuits Conference is a premier conference devoted to IC development. The conference program is a blend of oral presentations, exhibits, panels and forums.

Wednesday, April 16

5:30 p.m. – 6:15 p.m. CHISIC Keynote 1: Chip to Chip Communication for Next Generation AI Datacenters
6:15 p.m. – 8:15 p.m. CHISIC Networking Reception

Thursday, April 17

7:00 a.m. – 8:00 a.m. Breakfast
8:00 a.m. – 8:45 a.m.  CHISIC Keynote 2: Petascale photonic connectivity for energy efficient computing 
8:45 a.m. – 9:25 a.m. Chiplets and Connectivity Driving Next-Gen AI Networks
9:25 a.m. – 10:05 a.m. Power-Efficient Short Reach Electrical Links for the AI Era
10:05 a.m. - 10:20 a.m. Coffee Break
10:20 a.m. – 11:00 a.m. Open Chiplet Platforms for Embodied AI
11:00 a.m. – 11:40 a.m. Architecting Heterogenous System-of-Chiplets for Data Center and AI Era
11:40 a.m. – 12:20 p.m. Building Composable Chiplets
12:20 p.m. – 12: 25 p.m. CHISIC Group Photo
1:25 p.m. – 2:05 p.m. Enabling AI revolution through innovations in advanced packaging and chiplet technology
2:05 p.m. – 2:45 p.m. STCO, a new design paradigm to meet the challenges in designing 3D IC designs
2:45 p.m. – 3:25 p.m. EDA Solutions for Chiplet-based Multi-Die Systems
3:40 p.m. – 5:20 p.m. Navigating the Cooling Conundrum: A Thermal Roadmap for AI Modules
5:20 p.m. – 6:00 p.m. Reliability and Test of System-of-Chiplets in the AI Era
5:00 p.m. – 5:05 p.m. CHISIC Workshop Closing Ceremony